The MOSFET packaging shell primarily serves to support, protect, and cool the device. Additionally, it provides electrical connections and isolation for the chip, thereby forming a complete circuit between the MOSFET device and other components.
Different packages and designs will have different specifications, sizes, and various electrical parameters of MOSFET, and the roles they can play in the circuit will also be different; in addition, packaging is still the most important part of MOSFET in circuit design. Important reference for selection.
- MOSFET packaging classification
- Dual in-line package (DIP)
- Transistor Outline Package (TO)
- Small Outline Transistor Package (SOT)
- Small Outline Package (SOP)
MOSFET packaging classification
According to the method of installation on the PCB board, there are two main types of MOSFET packaging: plug-in (Through Hole) and surface mount (Surface Mount).
The plug-in type means that the pins of the MOSFET pass through the mounting holes of the PCB board and are welded to the PCB board. Topdiode common plug-in packages include: dual in-line package (DIP), transistor outline package (TO)
Topdiode Typical surface mount packages include: transistor outline (D-PAK), small outline transistor (SOT), small outline package (SOP), quad flat package (QFP).
Dual in-line package (DIP)
DIP packaging structure forms include: multi-layer ceramic dual-in-line DIP, single-layer ceramic dual-in-line DIP, lead frame DIP (including glass-ceramic sealing type, plastic encapsulation structure type, ceramic low-melting glass encapsulation type) wait. The characteristic of DIP packaging is that it can easily realize through-hole welding of PCB boards and has good compatibility with the motherboard.
Transistor Outline Package (TO)
Early packaging specifications, such as TO-3P, TO-3PF, TO-247, TO-92, TO-92L, TO-220, TO-220F, TO-251, etc. are all plug-in packaging designs.
In recent years, due to the high welding cost of the plug-in packaging process and inferior heat dissipation performance to patch-type products, the demand for surface mount market has been increasing, which has also led to the development of TO packaging into surface mount packaging.
Small Outline Transistor Package (SOT)
SOT (Small Out-Line Transistor) is a patch type low-power transistor package, mainly including SOT-23, SOT-89, SOT-143, SOT25 (SOT23-5), etc., and also derived types such as SOT323, SOT363/SOT26 (SOT23-6) , smaller in size than TO package.
Small Outline Package (SOP)
SOP (Small Out-Line Package) is one of the surface mount packages, also called SOL or DFP. The pins are drawn out from both sides of the package in a seagull wing shape (L shape). The materials are plastic and ceramic.
SOP packaging standards include SOP-8, SOP-16, SOP-20, SOP-28, etc. The number after SOP indicates the number of pins. Most SOP packages of MOSFETs adopt SOP-8 specifications. The industry often omits “P” and abbreviates it as SO (Small Out-Line).
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